Home
  About COMPLAS
  Organizers
  Supporting Organizations
  Conference Topics
  Conference Series
  Technical Programme NEW!
  Programme Overview
  Plenary Lectures
  Invited Sessions
  Registration
  Important Dates
  Registration Fees
  Submission and Contributions
  Instructions for Authors
  Social Events
  Location
  Plenary Lectures Videos
  Secretariat
  Download Poster
  Download Flyer
  Travelling to Spain
  Spain Travel Health
  Information for Foreigners
  COMPLAS COURSE

Sign Up / Log In
Number of visits: 70520


THIS AREA IS FOR AUTHORS ONLY

Submission of contributions and conference registration should be performed electronically via the conference web site.


About Abstract and Full Paper Submission

  • One page Abstract describing the main features of the work should be submitted before May 11, 2021.

  • The full paper (not mandatory) will be required by June 4, 2021.

    Conference Proceedings (including full papers only) will be published on Scipedia with DOI number after the congress and will be submitted for indexation to SCOPUS database. Submission of the full paper is not mandatory.

  • Download Templates

To make any change in the contribution submitted you have to login as the registered participant, update the paper information and submit the new file.

To check that the submission was successful you have to refresh the web site and login on again.

To avoid a double registration, please do not create a new record.


Please note that:

  • The corresponding author should be the lecturer.

  • Final acceptance is contingent upon payment of the registration fee by the presenting author on June 4, 2021 at the latest.

  • Only online payments will be accepted.


  • Only one presentation per registered participant is allowed.

You can contact the Conference Secretariat for any question.


International Centre for Numerical Methods in Engineering, Barcelona, Spain
complas_sec@cimne.upc.edu / Telf. + 34 - 93 405 46 96 - Fax. + 34 - 93 205 83 47
Copyright © 2017 CIMNE, All Rights Reserved.