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26/6/07 09:20 - 11:00
Fabrication,integration and packaging
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TuM1
Room: Auditorium
Chair: Robert Plana
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(INVITED) RF-MEMS Technology Platforms in Europe
H. Tilmans
Mechanical and Electrical Characterization of Benzocyclobutene Membrane Packaging
S. Seok, N. Rolland, P.A. Rolland
Co-integration of Highly Tunable MEMS Capacitor and High Quality Factor AlSi Inductors
A. Mehdaoui, C. Fillit, D. Tsamados, R.Y. Fillit, C. Billard, P. Ancey, A.M. Ionescu
GaAs Membrane-supported 60 GHz Receiver with Yagi-Uda Antenna
D Neculoiu, G Konstantinidis, T Vähä-Heikkilä, A Müller, D Vasilache, A Stavinidris, L Bary, M Dragoman, I Petrini, C Buiculescu, Z Hazoupulos, N Kornilios, P Pursula, R Plana, D Dascalu
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