KEYNOTE LECTURE IHPC’s ‘’Digital Twin’’ platform for additive manufacturing: seamless, multiscale high-fidelity forward-backward simulation of powder-bed fusion additive manufacturing L. Lu, L. Dai, Y. Chen, W. Ding, K. Bai, K. Wang, R. Hariharaputran, R. Ahuwalia, R. Lankowski, Q. Xie, J. Liu, S. Lu, G. Vastola and Y. Zhang Abstract |